Wafer Process Intern - Module Integration Summer2022

Profile

,AnswerValue:Module integration intern (MI intern) for 3D integration/heterogeneous integration activities (3DI/HI). 3DI/HI is a key technology for advanced semiconductor products. MI intern for 3DI/HI will work closely with 3DI/HI integration engineers to support technology developments.\u003cbr/\u003e\u003cbr/\u003eResponsibilities:\u003cbr/\u003e\tProvide support for wafer management and process experiments.\u003cbr/\u003e\tObtain evaluation data including process, inline metrology, electrical test results and physical analysis.\u003cbr/\u003e\tAid in automation of data analysis and statistical correlations to accelerate process evaluations.\u003cbr/\u003e\u003cbr/\u003e\u003cbr/\u003eQualifications:\u003cbr/\u003e\tEligibility to work in the U.S. is required.\u003cbr/\u003e\tA current college student pursuing bachelors or advanced degree in nano technology, or related field\u003cbr/\u003e\tExperience with Microsoft VBA or other programming languages (R, python, etc.) for statistical processing and data visualization tools is a plus.\u003cbr/\u003e\tAbility to take direction and feedback, also work independently when required.\u003cbr/\u003e\tAbility to perform inline measurements with physical analysis tools desired; Hitatchi XSEM, Hitachi CDSEM, XPS, electrical test prober. If needed, trainings will be provided.\u003cbr/\u003e\tTrainings will be provided for the logistic systems used as well as basic semiconductor process flow if needed.\u003cbr/\u003e\u003cbr/\u003e\u003cbr/\u003eEqual Opportunity Employer/Minorities/Females/Disabled/Veterans\u003cbr/\u003e,

Company info

Tokyo Electron U.S. Holdings, Inc.
Website : http://www.tel.com